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Productronica 2021
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parts2clean 2021
03
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21
IPC APEX EXPO 2021
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Hyper
SWASH
Fully automatic cleaning machine
Spray-in-air closed loop zero drain system
Multiple platform configuration
Superb for cleaning high volume of electronic assemblies
APPLICATION
Defluxing – removing all kinds of solder residues
Cleaning of micromechanical components
Removing contamination from handling and board manufacturing, FOD
Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, BTC, QFN, MELF
Cleaning of power electronics
For electronic assemblies requiring extra short process time
Ideal for second side misprints on complex assemblies
Cleaning before conformal coating and wire bonding
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SuperSWASH
Fully automatic high performance zero drain system
Ideal for cleaning middle to high volume of electronic assemblies
Suitable for cleaning high volume of stencils
APPLICATION
Defluxing, removing activators and resin residues
Cleaning contamination from handling and board manufacturing
Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, LGA, MELF etc.
Cleaning of power electronics
Cleaning electronic assemblies requiring extra short process time
Cleaning second side misprints on complex assemblies
Cleaning before conformal coating
Cleaning before wire bonding
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MiniSWASH
Fully automatic zero drain system
Ideal for cleaning stencils, screens and misprints
Suitable for defluxing of small volume of PCBA with high quality requirements
APPLICATION
Removing solder paste from any type of stencils, screens and printer squeegees
Removing SMT Glue residues from any type of stencils, screens or PumpPrint stencils
Defluxing, removing activators and resin residues, cleaning contamination from handling and board manufacturing
Cleaning second side misprints on complex assemblies
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CompaCLEAN
Fully automatic zero drain system
Ideal for cleaning middle to high volume of electronic assemblies
Suitable also for cleaning of soldering pallets and mechanical parts
APPLICATION
Defluxing, removing activators and resin residues
Cleaning contamination from handling and board manufacturing
Cleaning second side misprints on complex assemblies
Cleaning before conformal coating
Cleaning of soldering pallets
Fine degreasing of mechanical parts
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UniCLEAN
Manual operated dip-tank cleaning system
Full process parameters control by PC
Ideal for cleaning of small volume of PCBA
Perfect for cleaning of micromechanical parts
Flexible configuration of cleaning technologies
APPLICATION
Defluxing, removing all kinds of solder residues
Cleaning of micromechanical components
Cleaning contamination from handling and board manufacturing, FOD
Cleaning highly populated electronic assemblies with low standoff components such as BGA, CSP, LGA, MELF etc.
Cleaning before conformal coating
Cleaning before wire bonding
Cleaning by water based or semi-aqua cleaners
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